Engineered for Precision. Built for Packaging Performance.
October 18–21, 2026 | McCormick Place | Chicago, IL USA | Booth N-6047
Nidec Drive Technology is pleased to announce its participation at PACK EXPO International 2026, bringing together packaging and processing professionals to explore advancements in automation, motion control, and manufacturing technology
Today’s packaging and processing systems are expected to operate faster, more accurately, and more efficiently than ever before. Machine builders and manufacturers continue to pursue higher throughput, greater precision, increased flexibility, and maximum uptime. Meeting these objectives requires motion technologies that provide accurate positioning, repeatable performance, high torque density, and long-term reliability.
At Booth N-6047, visitors will have the opportunity to explore precision motion solutions designed to help OEMs, system integrators, and manufacturers address a wide range of packaging and processing applications. Featured technologies include planetary, strain wave, cycloidal, rotary index, and rack and pinion solutions, particularly well suited for applications requiring accurate positioning, repeatable motion, and dependable performance.
From cartoning, case packing, and filling systems to conveying, palletizing, labeling, and other automated equipment, precision motion plays an important role in overall machine performance.
Whether you’re developing new packaging equipment or enhancing existing production systems, our engineering and sales teams will be available to discuss your application challenges and collaborate on motion solutions tailored to your performance objectives.
Visit Booth N-6047 to explore our featured technologies, meet our team, and discuss how Nidec Drive Technology can support your packaging and processing applications.
We look forward to seeing you in Chicago.
